Apple is enhancing its collaboration with TSMC to develop a hybrid System on Integrated Chip (SoIC) package that incorporates innovative thermoplastic carbon fiber composite molding technology.
This generation of chips is expected to focus heavily on AI performance, featuring a more powerful Neural Processing Unit (NPU) that surpasses the M4's capabilities.
Consumers considering a new MacBook Pro may opt to wait for the 2026 model, which is rumored to feature a complete redesign for a thinner and lighter profile.
The base variant of the M5 chip has already entered production, with packaging processes currently underway.
While ETnews has a reliable history regarding Apple's supply chain, its predictions about product timelines and specifics may not always be accurate.
The packaging of the M5 chip will be handled by multiple companies, with Taiwan's ASE Group leading the initial mass production, followed by Amkor in the US and JCET in China.
Apple is set to introduce its M5 chip in 2025 models of the MacBook Pro, iPad Pro, and Vision Pro, marking a significant advancement in their silicon technology.
Manufactured by TSMC using their advanced third-generation 3nm N3P process, the M5 chip promises up to 10% greater efficiency and 5% increased speed compared to its predecessor, the M4 chip.
References to the M5 chip have emerged in Apple's official code, suggesting its integration into AI server infrastructure to bolster both consumer and cloud service capabilities.
Designed to operate cooler than previous models, the M5 chip will maintain peak performance longer, reducing the likelihood of thermal throttling.
Despite the advancements with the M5 chip, Apple is not expected to implement significant design changes until 2026, when a shift from miniLED to OLED displays may occur.
The high-end M5 models will utilize TSMC's SoIC technology to improve thermal management and performance through a 3D chip-stacking approach.
